Response Surface Designs

Experimental Objective

An engineer is interested in following up the IC Fabrication Screening experiment in Chapter 5 with a response surface design in order to identify factor settings that optimize the process. This experiment showed that acid flow rate was not significant, so that factor will not be considered here.

Table 7.1 describes the factors and responses of the new experiment with their ranges.

Table 7.1: Factors and Responses of the IC Fabrication Screening Experiment

Type	Name	Low	High	Description
Factors	TEMP	1210	1220	Deposition
				temp (C)
	FLOW	55	60	Arsenic flow rate
	TIME	10	16	Deposition time
	ETCH	1180	1200	Etch rate
Responses	THCKNESS			Thickness of film
	RESTIVTY			Resistivity of final
				film layer

The experiment takes three days to run, and each day will be run in a separate block.

The goal of the experiment is to determine factor settings that result in a film thickness of 60 and maximum resistivity.

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Task List